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Item Details
| Title:
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APPLICATION OF FRACTURE MECHANICS IN ELECTRONIC PACKAGING AND MATERIALS
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| Volume: |
International Mechanical Engineering Congress and Exposition, San 1995 |
| By: |
R.A. Pearson |
| Format: |
Hardback |
| List price:
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£72.00 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
0791817369 |
| ISBN 13: |
9780791817360 |
| Publisher: |
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Series: |
EEP S. v. 11 |
| Pages: |
280 |
| Description: |
Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal |
| Synopsis: |
Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal |
| Publication: |
US |
| Imprint: |
American Society of Mechanical Engineers,U.S. |
| Returns: |
Non-returnable |
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