| Title:
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PACKAGING OF HIGH POWER SEMICONDUCTOR LASERS
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| By: |
Xingsheng Liu, Wei Zhao, Lingling Xiong |
| Format: |
Hardback |
| List price:
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£139.99 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
1461492629 |
| ISBN 13: |
9781461492627 |
| Publisher: |
SPRINGER-VERLAG NEW YORK INC. |
| Pub. date: |
15 July, 2014 |
| Edition: |
2015 ed. |
| Series: |
Micro- and Opto-Electronic Materials, Structures, and Systems |
| Pages: |
402 |
| Description: |
This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques. |
| Synopsis: |
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail. |
| Illustrations: |
27 Tables, black and white; 386 Illustrations, color; 111 Illustrations, |
| Publication: |
US |
| Imprint: |
Springer-Verlag New York Inc. |
| Returns: |
Non-returnable |