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Item Details
| Title:
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INTRODUCTION TO MICROSYSTEM PACKAGING TECHNOLOGY
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| By: |
Yufeng Jin, Zhiping Wang, Jing Chen |
| Format: |
Hardback |
| List price:
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£175.00 |
| Our price: |
£157.50 |
| Discount: |
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| You save:
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£17.50 |
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| ISBN 10: |
1439819106 |
| ISBN 13: |
9781439819104 |
| Availability: |
Usually dispatched within 1-3 weeks.
 Delivery
rates
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| Stock: |
Currently 0 available |
| Publisher: |
TAYLOR & FRANCIS INC |
| Pub. date: |
16 March, 2010 |
| Pages: |
232 |
| Description: |
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP. |
| Synopsis: |
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems.Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies. |
| Illustrations: |
138 black & white illustrations, 16 black & white tables |
| Publication: |
US |
| Imprint: |
CRC Press Inc |
| Returns: |
Returnable |
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