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Item Details
| Title:
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DESIGN AND ANALYSIS OF HEAT SINKS
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| By: |
Allan D. Kraus, Avram Bar-Cohen |
| Format: |
Hardback |
| List price:
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£157.95 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
0471017558 |
| ISBN 13: |
9780471017554 |
| Publisher: |
JOHN WILEY AND SONS LTD |
| Pub. date: |
13 February, 1996 |
| Series: |
Thermal Management of Microelectronic and Electronic System Series |
| Pages: |
424 |
| Description: |
This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices. |
| Synopsis: |
A powerful methodology for producing superior thermal performance at low cost with minimum added mass ...Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering. |
| Illustrations: |
Illustrations |
| Publication: |
US |
| Imprint: |
John Wiley & Sons Inc |
| Returns: |
Returnable |
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