Title:
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2013 PROCEEDINGS OF THE ASME 2013 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (IPACK2013)
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Volume: |
Volume 2 |
By: |
American Society of Mechanical Engineers (ASME) |
Format: |
Paperback |

List price:
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£189.00 |
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ISBN 10: |
0791855767 |
ISBN 13: |
9780791855768 |
Publisher: |
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
Pub. date: |
30 December, 2013 |
Pages: |
680 |
Description: |
This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies. |
Synopsis: |
Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies. Printed collection on 80 full-length, peer-reviewed technical papers. Topics include:* Thermal Management* Data Centers and Energy Efficient Electronic Systems |
Publication: |
US |
Imprint: |
American Society of Mechanical Engineers,U.S. |
Returns: |
Returnable |