pickabook books with huge discounts for everyone
pickabook books with huge discounts for everyone
Visit our new collection website www.collectionsforschool.co.uk
     
Email: Subscribe to news & offers:
Need assistance? Log In/Register


Item Details
Title: RELIABILITY MONITORING USING SENSOR TECHNOLOGIES
By: Michael Pecht
Format: Electronic book text

List price: £74.99


We believe that this item is permanently unavailable, and so we cannot source it.

ISBN 10: 1482274310
ISBN 13: 9781482274318
Publisher: TAYLOR & FRANCIS LTD
Pub. date: 15 April, 2006
Synopsis: This text is devoted to the physics-of-failure approach to product reliability using sensor technologies. As a number of products have been observed to fail over time by gradual accumulation of damage due to operation in their life cycle environment, monitoring of life cycle environments lends itself to a scheme for estimating product damage, which can be used as a measure of when a product can be expected to fail. A well-designed maintenance scheme based on a health monitoring methodology can be used to predict and prevent product failure, and reduce maintenance costs. This book describes the development of such a maintenance scheme, and also provides a guide for the selection of sensor technologies.
Illustrations: 117 Illustrations, black and white
Publication: UK
Imprint: CRC Press
Returns: Non-returnable
Some other items by this author:
ADVANCED ROUTING OF ELECTRONIC MODULES (HB)
CHINA'S ELECTRONICS INDUSTRY (PB)
CONTAMINATION OF ELECTRONIC ASSEMBLIES (HB)
ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
ELECTRONIC PACKAGING RELIABILITY (PB)
ELECTRONICS INDUSTRY IN TAIWAN (HB)
ELECTRONICS INDUSTRY IN TAIWAN (PB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (HB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (PB)
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY (HB)
HANDBOOK OF ELECTRONIC PACKAGE DESIGN (HB)
IC COMPONENT SOCKETS (HB)
INFLUENCE OF TEMPERATURE ON MICROELECTRONICS AND SYSTEM RELIABILITY (HB)
INTEGRATED CIRCUIT, HYBRID AND MULTICHIP MODULE PACKAGE DESIGN (HB)
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES
KOREAN ELECTRONICS INDUSTRY (HB)
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT (HB)
PLACEMENT AND ROUTING OF ELECTRONIC MODULES (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK, SECOND EDITION
QUALITY CONFORMANCE AND QUALIFICATION OF MICROELECTRONIC PACKAGES AND INTERCONNECTS (PB)
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING (HB)
RELIABILITY OF POWER ELECTRONIC CONVERTER SYSTEMS
SOLDERING PROCESSES AND EQUIPMENT (HB)
THE CHINESE ELECTRONICS INDUSTRY (HB)
THE CHINESE ELECTRONICS INDUSTRY (PB)
THE JAPANESE ELECTRONICS INDUSTRY (PB)
THE KOREAN ELECTRONICS INDUSTRY (PB)



Information provided by www.pickabook.co.uk
SHOPPING BASKET
  
Your basket is empty
  Total Items: 0
 

NEW
Ramadan and Eid al-Fitr A celebratory, inclusive and educational exploration of Ramadan and Eid al-Fitr for both children that celebrate and children who want to understand and appreciate their peers who do.
add to basket

Learning
That''s My Story!: Drama for Confidence, Communication and C... The ability to communicate is an essential life skill for all children, underpinning their confidence, personal and social wellbeing, and sense of self.
add to basket