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Item Details
Title: ADVANCED METALLIZATION CONFERENCE 2000 (AMC 2000)
Volume: Volume 16
By: Dan Edelstein (Editor), Girish Dixit (Editor), Yukio Yasuda (Editor)
Format: Hardback

List price: £22.99


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ISBN 10: 1558995749
ISBN 13: 9781558995741
Publisher: MATERIALS RESEARCH SOCIETY
Pub. date: 1 March, 2002
Series: MRS Conference Proceedings
Pages: 706
Description: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Synopsis: This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterization; and Part IX covers continuing advances in the Al(Cu)/W metallization system.
Publication: US
Imprint: Materials Research Society
Returns: Returnable
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