| Title:
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THREE-DIMENSIONAL INTEGRATION AND MODELING
A REVOLUTION IN RF AND WIRELESS PACKAGING |
| By: |
Jong Hoon Lee, Manos M. Tentzeris, Constantine A. Balanis |
| Format: |
Paperback |
| List price:
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£40.95 |
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| ISBN 10: |
1598292447 |
| ISBN 13: |
9781598292442 |
| Publisher: |
MORGAN & CLAYPOOL PUBLISHERS |
| Pub. date: |
29 June, 1905 |
| Series: |
Synthesis Lectures on Computational Electromagnetics S. |
| Pages: |
108 |
| Description: |
Presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. This book includes various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule. |
| Synopsis: |
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. |
| Illustrations: |
black & white illustrations |
| Publication: |
US |
| Imprint: |
Morgan & Claypool Publishers |
| Returns: |
Non-returnable |