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Your search for " SERIES like 'EEP S. v. 16' " has produced 11 results.
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1.
Proceedings of the International Electronic Packaging Confer...(Paperback)
Interpack 95 1995
American Society of Mechanical Engineers,U.S.
Published: 01/01/1995

In Stock: None
List Price: £361.00
2.
Structural Analysis in Microelectronics and Fiber Optics Int...(Paperback)
International Mechanical Engineering Congress and Exposition, Atlanta, 1996
American Society of Mechanical Engineers,U.S.
Published: 01/01/1996
Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-op...

In Stock: None
List Price: £75.95
3.
Sensing, Modeling and Simulation in Emerging Electronic Pack...(Paperback)
1996
American Society of Mechanical Engineers,U.S.
Published: 01/01/1996
Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip ...

In Stock: None
List Price: £54.50
4.
Application of CAE/CAD to Electronic Systems(Hardback)
International Mechanical Engineering Congress and Exposition, Atlanta, 1996
American Society of Mechanical Engineers,U.S.
Published: 15/11/1996
Proceedings of the November 1996 symposium sponsored by the Computer Aided Design for Electronic Packaging Committee of the Electrical and Electronic Packaging Division. Contains 15 papers, includin...

In Stock: None
List Price: £55.50
5.
Proceedings of the Pacific Rim/ASME International Intersocie...(Paperback)
1997
American Society of Mechanical Engineers,U.S.
Published: 01/01/1997
These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and ch...

In Stock: None
List Price: £451.00
6.
Application of Fracture Mechanics in Electronic Packaging an...(Hardback)
International Mechanical Engineering Congress and Exposition, San 1995
American Society of Mechanical Engineers,U.S.
Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fractu...

In Stock: None
List Price: £72.00
7.
Structural Analysis in Microelectronic and Fiber Optic Syste...(Hardback)
International Mechanical Engineering Congress and Exposition, San 1995
American Society of Mechanical Engineers,U.S.

In Stock: None
List Price: £66.00
8.
Applications of Experimental Mechanics to Electronmic Packag...(Hardback)
1
Published: 15/11/1995

In Stock: None
List Price: £48.50
9.
Structural Analysis in Microelectronics and Fiber Optics Int...(Paperback)
1997
American Society of Mechanical Engineers,U.S.
Published: 01/01/1997
A selection of 16 papers applying theoretical and experimental methods of structural analysis and engineering mechanics to various mechanical, materials, and manufacturing problems in microelectroni...

In Stock: None
List Price: £99.50
10.
Applications of Experimental Mechanics of Electronic Packagi...(Hardback)
International Mechanical Engineering Congress and Exposition, Dallas, 1997
American Society of Mechanical Engineers,U.S.
Published: 15/11/1997
Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sens...

In Stock: None
List Price: £69.50
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